Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. - Kenny C. Otiaba; R. S. Bhatti; Ndy N. Ekere; Sabuj Mallik; M. O. Alam; Emeka H. Amalu; Mathias Ekpu (Microelectron. Reliab., 2012)

The effect of thermal constriction on heat management in a microelectronic application. - Mathias Ekpu; Raj S. Bhatti; Michael I. Okereke; Sabuj Mallik; Kenny C. Otiaba (Microelectron. J., 2014)

Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. - Mathias Ekpu; Raj S. Bhatti; Michael I. Okereke; Sabuj Mallik; Kenny C. Otiaba (Microelectron. Reliab., 2014)