Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications. - Tanja Braun; Karl-Friedrich Becker; Mathias Koch; Volker Bader; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2005)

High-temperature reliability of Flip Chip assemblies. - Tanja Braun; Karl-Friedrich Becker; Mathias Koch; Volker Bader; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2006)