Guest Editorial. - Robert Neal Dean; Pradeep Lall; Mathias Nowottnick; William R. Harrell (IEEE Trans. Ind. Electron., 2011)

Characterization of Ti diffusion in PVD deposited WTi/AlCu metallization on monocrystalline Si by means of secondary ion mass spectroscopy. - Mathias Plappert; Oliver Humbel; Angelika Koprowski; Mathias Nowottnick (Microelectron. Reliab., 2012)

Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti. - Michael Fugger; Mathias Plappert; Carsten Schäffer; Oliver Humbel; Herbert Hutter; Herbert Danninger; Mathias Nowottnick (Microelectron. Reliab., 2014)

Highly variable Sn-Cu diffusion soldering process for high performance power electronics. - D. Feil; T. Herberholz; M. Guyenot; Mathias Nowottnick (Microelectron. Reliab., 2017)

Selective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors. - Dirk Seehase; Christian Kohlen; Arne Neiser; Andrej Novikov; Mathias Nowottnick (Period. Polytech. Electr. Eng. Comput. Sci., 2018)

Reliability investigation of large area solder joints in power electronics modules and its simulative representation. - Allen Jose George; Juergen Zipprich; Marlies Breitenbach; Markus Klingler; Mathias Nowottnick (Microelectron. Reliab., 2018)