Methoden und Programme zur rechnergestützten Anpassungskonstruktion von Justier- und Prüfmittelbaugruppen. - Matthias Petzold (1991)

Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy. - Sebastian Brand 001; P. Czurratis; P. Hoffrogge; Matthias Petzold (Microelectron. Reliab., 2010)

Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire. - Rainer Dohle; Matthias Petzold; Robert Klengel; Holger Schulze; Frank Rudolf (Microelectron. Reliab., 2011)

Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials. - Benjamin März; Andreas Graff; Robert Klengel; Matthias Petzold (Microelectron. Reliab., 2014)

Lifetime prediction of thick aluminium wire bonds for mechanical cyclic loads. - Lutz Merkle; Marcus Sonner; Matthias Petzold (Microelectron. Reliab., 2014)

Innovative Failure Analysis Techniques for 3-D Packaging Developments. - Frank Altmann; Matthias Petzold (IEEE Des. Test, 2016)

Editorial: ESREF 2016. - Matthias Petzold (Microelectron. Reliab., 2016)

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects. - Glenn Ross; Vesa Vuorinen; Michael Krause 008; S. Reissaus; Matthias Petzold; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2017)