Estimation of RF performance from LF measurements: Towards the design for reliability in RF-MEMS. - Nuria Torres Matabosch; Mehmet Kaynak; Fabio Coccetti; Matthias Wietstruck; Bernd Tillack; Jean Louis Cazaux (Microelectron. Reliab., 2012)

200 mm Wafer level graphene transfer by wafer bonding technique. - Mesut Inac; Grzegorz Lupina; Matthias Wietstruck; Marco Lisker; Mirko Fraschke; Andreas Mai; Fabio Coccetti; Mehmet Kaynak (ESSDERC, 2017)

Experiments on MEMS Integration in 0.25 μm CMOS Process. - Piotr Michalik; Daniel Fernández; Matthias Wietstruck; Mehmet Kaynak; Jordi Madrenas (Sensors, 2018)

Advanced Thermal Modeling of IC - Package Interaction. - Zhibo Cao; Matteo Stocchi; Matthias Wietstruck; Federico Garbuglia; Diego Pincini; Mehmet Kaynak (RWS, 2020)

Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling. - Patrick Krüger; Thomas Voß; Matthias Wietstruck (3DIC, 2021)

SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications. - Emre Can Durmaz; Carl Heine; Zhibo Cao; Jens Lehmann 002; Dietmar Kissinger; Matthias Wietstruck (3DIC, 2023)