Diamond-Coated Cantilevers for Scanning Capacitance Microscopy Applications. - H. Yabuhara; Mauro Ciappa; Wolfgang Fichtner (Microelectron. Reliab., 2001)

Selected failure mechanisms of modern power modules. - Mauro Ciappa (Microelectron. Reliab., 2002)

A Novel Thermomechanics -Based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors. - Mauro Ciappa; Flavio Carbognani; Paolo Cova; Wolfgang Fichtner (Microelectron. Reliab., 2002)

Simulation and Experimental Validation of Scanning Capacitance Microscopy Measurements across Low-doped Epitaxial PN-Junction. - Maria Stangoni; Mauro Ciappa; Marco Buzzo; Markus Leicht; Wolfgang Fichtner (Microelectron. Reliab., 2002)

On the behaviour of the selective iodine-based gold etch for the failure analysis of aged optoelectronic devices. - Giovanna Mura; Massimo Vanzi; Maria Stangoni; Mauro Ciappa; Wolfgang Fichtner (Microelectron. Reliab., 2003)

A New Procedure to Define the Zero-Field Condition and to Delineate pn-Junctions in Silicon Devices by Scanning Capacitance Microscopy. - Maria Stangoni; Mauro Ciappa; Wolfgang Fichtner (Microelectron. Reliab., 2003)

2D Dopant Profiling on 4H Silicon Carbide P+N Junction by Scanning Capacitance and Scanning Electron Microscopy. - Marco Buzzo; Markus Leicht; Thomas Schweinböck; Mauro Ciappa; Maria Stangoni; Wolfgang Fichtner (Microelectron. Reliab., 2004)

On the Use of Neural Networks to Solve the Reverse Modelling Problem for the Quantification of Dopant Profiles Extracted by Scanning Probe Microscopy Techniques. - Mauro Ciappa; Maria Stangoni; Wolfgang Fichtner; Elisa Ricci 001; Andrea Scorzoni (Microelectron. Reliab., 2004)

Characterization of self-heating effects in semiconductor resistors during transmission line pulses. - Chiara Corvasce; Mauro Ciappa; Davide Barlini; S. Sponton; Gaudenzio Meneghesso; Wolfgang Fichtner (Microelectron. Reliab., 2004)

Two-dimensional Dopant Profiling and Imaging of 4H Silicon Carbide Devices by Secondary Electron Potential Contrast. - Marco Buzzo; Mauro Ciappa; Maria Stangoni; Wolfgang Fichtner (Microelectron. Reliab., 2005)

Lifetime prediction on the base of mission profiles. - Mauro Ciappa (Microelectron. Reliab., 2005)

Extraction of Accurate Thermal Compact Models for Fast Electro-Thermal Simulation of IGBT Modules in Hybrid Electric Vehicles. - Mauro Ciappa; Wolfgang Fichtner; T. Kojima; Y. Yamada; Y. Nishibe (Microelectron. Reliab., 2005)

Assessment of the Analytical Capabilities of Scanning Capacitance and Scanning Spreading Resistance Microscopy Applied to Semiconductor Devices. - Maria Stangoni; Mauro Ciappa; Wolfgang Fichtner (Microelectron. Reliab., 2005)

New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions. - Davide Barlini; Mauro Ciappa; Alberto Castellazzi; Michel Mermet-Guyennet; Wolfgang Fichtner (Microelectron. Reliab., 2006)

Characterization of photonic devices by secondary electron potential contrast. - Marco Buzzo; Mauro Ciappa; Wolfgang Fichtner (Microelectron. Reliab., 2006)

Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications. - Alberto Castellazzi; Mauro Ciappa; Wolfgang Fichtner; G. Lourdel; Michel Mermet-Guyennet (Microelectron. Reliab., 2006)

Measurement of the transient junction temperature in MOSFET devices under operating conditions. - Davide Barlini; Mauro Ciappa; Michel Mermet-Guyennet; Wolfgang Fichtner (Microelectron. Reliab., 2007)

A study of the threshold-voltage suitability as an application-related reliability indicator for planar-gate non-punch-through IGBTs. - Alberto Castellazzi; Mauro Ciappa; Wolfgang Fichtner; M. Piton; Michel Mermet-Guyennet (Microelectron. Reliab., 2007)

SCR operation mode of diode strings for ESD protection. - Ulrich Glaser; Kai Esmark; Martin Streibl; Christian Russ; Krzysztof Domanski; Mauro Ciappa; Wolfgang Fichtner (Microelectron. Reliab., 2007)

Virtual reliability assessment of integrated power switches based on multi-domain simulation approach. - Pierre Solomalala; J. Saiz; Michel Mermet-Guyennet; Alberto Castellazzi; Mauro Ciappa; X. Chauffleur; Jean-Pierre Fradin (Microelectron. Reliab., 2007)

Robustness test and failure analysis of IGBT modules during turn-off. - Jesús Urresti-Ibañez; Alberto Castellazzi; M. Piton; José Rebollo; Michel Mermet-Guyennet; Mauro Ciappa (Microelectron. Reliab., 2007)

Novel simulation approach for transient analysis and reliable thermal management of power devices. - Alberto Castellazzi; Mauro Ciappa (Microelectron. Reliab., 2008)

Novel Solution for the Built-in Gate Oxide Stress Test of LDMOS in Integrated Circuits for Automotive Applications. - Vezio Malandruccolo; Mauro Ciappa; Wolfgang Fichtner; Hubert Rothleitner (ETS, 2009)

Ensuring the reliability of electron beam crosslinked electric cables by the optimization of the dose depth distribution with Monte Carlo simulation. - Mauro Ciappa; Luigi Mangiacapra; Maria Stangoni; Stephan Ott; Wolfgang Fichtner (Microelectron. Reliab., 2009)

Multiscale simulation of aluminum thin films for the design of highly-reliable MEMS devices. - Haruka Kubo; Mauro Ciappa; Takayuki Masunaga; Wolfgang Fichtner (Microelectron. Reliab., 2009)

A new built-in screening methodology to achieve zero defects in the automotive environment. - Vezio Malandruccolo; Mauro Ciappa; Hubert Rothleitner; Wolfgang Fichtner (Microelectron. Reliab., 2009)

Novel built-in methodology for defect testing of capacitor oxide in SAR analog to digital converters for critical automotive applications. - Vezio Malandruccolo; Mauro Ciappa; Wolfgang Fichtner; Hubert Rothleitner (ETS, 2010)

Modeling secondary electron images for linewidth measurement by critical dimension scanning electron microscopy. - Mauro Ciappa; Alexander Koschik; Maurizio Dapor; Wolfgang Fichtner (Microelectron. Reliab., 2010)

A new built-in screening methodology for Successive Approximation Register Analog to Digital Converters. - Vezio Malandruccolo; Mauro Ciappa; Hubert Rothleitner; M. Hommel; Wolfgang Fichtner (Microelectron. Reliab., 2010)

Accurate extraction of the mechanical properties of thin films by nanoindentation for the design of reliable MEMS. - Yuji Sasaki; Mauro Ciappa; Takayuki Masunaga; Wolfgang Fichtner (Microelectron. Reliab., 2010)

A New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment. - Vezio Malandruccolo; Mauro Ciappa; Hubert Rothleitner; Wolfgang Fichtner (J. Electron. Test., 2011)

Design of optimum electron beam irradiation processes for the reliability of electric cables used in critical applications. - Mauro Ciappa; Luigi Mangiacapra; Maria Stangoni; Stephan Ott; Wolfgang Fichtner (Microelectron. Reliab., 2011)

Synthesis of scanning electron microscopy images by high performance computing for the metrology of advanced CMOS processes. - Aniello Esposito; Mauro Ciappa; Wolfgang Fichtner (Microelectron. Reliab., 2011)

Editorial. - Mauro Ciappa; Paolo Cova; Francesco Iannuzzo; Gaudenzio Meneghesso (Microelectron. Reliab., 2012)

Monte Carlo simulation of emission site, angular and energy distributions of secondary electrons in silicon at low beam energies. - Mauro Ciappa; Emre Ilgünsatiroglu; Alexey Yu. Illarionov (Microelectron. Reliab., 2012)

Electro-thermal simulation in the time domain of GaN HEMT for RF switch-mode amplifier. - Satoshi Ono; Mauro Ciappa; Shigeru Hiura; Wolfgang Fichtner (Microelectron. Reliab., 2012)

Avoiding misleading artefacts in metallurgical preparation of die attach solder joints in high power modules. - Franc Dugal; Mauro Ciappa (Microelectron. Reliab., 2013)

Unstructured tetrahedric meshes for the description of complex three-dimensional sample geometries in Monte Carlo simulation of scanning electron microscopy images for metrology applications. - Emre Ilgünsatiroglu; Alexey Yu. Illarionov; Mauro Ciappa (Microelectron. Reliab., 2013)

A new two-dimensional TCAD model for threshold instability in silicon carbide MOSFETs. - Takuo Kikuchi; Mauro Ciappa (Microelectron. Reliab., 2013)

Monte Carlo modeling of the extraction of roughness parameters at nanometer scale by Critical Dimension Scanning Electron Microscopy. - Mauro Ciappa; Emre Ilgünsatiroglu; Alexey Yu. Illarionov; F. Filosomi; C. Santini (ESSDERC, 2014)

Exact 3D simulation of Scanning Electron Microscopy images of semiconductor devices in the presence of electric and magnetic fields. - Mauro Ciappa; Alexey Yu. Illarionov; Emre Ilgünsatiroglu (Microelectron. Reliab., 2014)

Exploring the limits of scanning electron microscopy for the metrology of critical dimensions of photoresist structures in the nanometer range. - Mauro Ciappa; Emre Ilgünsatiroglu; Alexey Yu. Illarionov (Microelectron. Reliab., 2014)

Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules. - Franc Dugal; Mauro Ciappa (Microelectron. Reliab., 2014)

Reliability odometer for real-time and in situ lifetime measurement of power devices. - Mauro Ciappa; Alessandro Blascovich (Microelectron. Reliab., 2015)

TCAD simulation of current filamentation in adjacent IGBT cells under turn-on and turn-off short circuit condition. - Hiroshi Suzuki; Mauro Ciappa (Microelectron. Reliab., 2015)

Reliability issues in power electronics. - Francesco Iannuzzo; Mauro Ciappa (Microelectron. Reliab., 2016)

Modeling the threshold voltage instability in SiC MOSFETs by multiphonon-assisted tunneling. - Takuo Kikuchi; Mauro Ciappa (Microelectron. Reliab., 2016)

Electro-thermal simulation of current sharing in silicon and silicon carbide power modules under short circuit condition of types I and II. - Hiroshi Suzuki; Mauro Ciappa (Microelectron. Reliab., 2016)

Reliability investigation of the copper-zinc system for solid diffusion bonding in power modules. - Franc Dugal; Mauro Ciappa (Microelectron. Reliab., 2017)

Experimental characterization of critical high-electric field spots in power semiconductors by planar and scanning collimated alpha sources. - Mauro Ciappa; Ying Pang; Chenchen Sun (Microelectron. Reliab., 2018)

Charge and energy deposition in thick silicon depletion layers by environmental ionizing radiation and terrestrial cosmic rays. - Ying Pang; Mauro Ciappa (Microelectron. Reliab., 2018)

Measurement of the Pre-Breakdown Characteristics in Silicon Carbide Power Devices by the Use of Radioactive Gamma Sources. - Mauro Ciappa; Marco Pocaterra (IRPS, 2020)

Assessing the pre-breakdown carriers' multiplication in SiC power MOSFETs by soft gamma radiation and its correlation to the Terrestrial Cosmic Rays failure rate data as measured by neutron irradiation. - Mauro Ciappa; Marco Pocaterra (IRPS, 2021)