A 0.14mW/Gbps high-density capacitive interface for 3D system integration. - Alberto Fazzi; Luca Magagni; Mauro Mirandola; Roberto Canegallo; Stefan Schmitz; Roberto Guerrieri (CICC, 2005)

Electrical measurement of alignment for 3D stacked chips. - Roberto Canegallo; Mauro Mirandola; Alberto Fazzi; Luca Magagni; Roberto Guerrieri; Karin Kaschlun (ESSCIRC, 2005)

3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly. - Alberto Fazzi; Luca Magagni; Mauro Mirandola; Barbara Charlet; Léa Di Cioccio; Erik Jung; Roberto Canegallo; Roberto Guerrieri (IEEE J. Solid State Circuits, 2007)