Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. - Lionel Cadix; Alexis Farcy; Cédric Bermond; Christine Fuchs; Patrick Leduc; Maxime Rousseau; Myriam Assous; Alexandre Valentian; Julie Roullard; Elie Eid; Nicolas Sillon; Bernard Fléchet; et al. (3DIC, 2009)

First integration of Cu TSV using die-to-wafer direct bonding and planarization. - Patrick Leduc; Myriam Assous; Léa Di Cioccio; Marc Zussy; Thomas Signamarcheix; Antonio Roman; Maxime Rousseau; Sophie Verrun; Laurent Bally; David Bouchu; Lionel Cadix; Alexis Farcy; et al. (3DIC, 2009)

pfla: A Python Package for Dental Facial Analysis using Computer Vision and Statistical Shape Analysis. - Maxime Rousseau; Jean-Marc Retrouvey (J. Open Source Softw., 2018)