Mayu Aoki

According to our database1, Mayu Aoki authored at least 3 papers between 2010 and 2011.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2011
Chip-level TSV integration for rapid prototyping of 3D system LSIs.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Void reduction in wafer bonding by simultaneously formed ventilation channels.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010
Wafer-level hybrid bonding technology with copper/polymer co-planarization.
Proceedings of the IEEE International Conference on 3D System Integration, 2010


  Loading...