Voltage-based electromigration immortality check for general multi-branch interconnects. - Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Taeyoung Kim 001; Xin Huang 003; Sheldon X.-D. Tan (ICCAD, 2016)

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. - Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Chase Cook; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018)

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. - Chase Cook; Zeyu Sun 001; Ertugrul Demircan; Mehul D. Shroff; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2018)

Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis. - Shaoyi Peng; Ertugrul Demircan; Mehul D. Shroff; Sheldon X.-D. Tan (Integr., 2020)

An efficient methodology to evaluate BEOL and MOL TDDB in advanced nodes. - Sumy Jose; Chunshan Yin; Yu Chen; Cheong Min Hong; Mehul D. Shroff; Xiaoling Zhao; Fan Zhang (IRPS, 2021)

A Fast, Statistical, Machine-learning Approach for Automotive Semiconductor Test Reduction. - Mehul D. Shroff; Nguyen Nguyen; Kiran Sunny Thota (ITC, 2024)