BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond. - Gaurav Thareja; Ashish Pal; Xingye Wang; Sefa Dag; Shi You; Shashank Sharma; Qing Zhu; Carmen L. Cervantes; Shinjae Hwang; Matthew Spuller; Ben Ng; Pradeep S. Kumar; et al. (VLSI Technology and Circuits, 2023)

Characterization and Multiscale Modeling of TDDB in State-of-the-art BEOL. - Andrea Palmieri; Mahdi Tavakoli; Chi Ching; Wenkai Zheng; Shi You; Xiaodong Zhang; Davide Cornigli; Michael Haverty; Navneet Singh; Luca Larcher; Monika Jamieson; Ajay Bhatnagar; et al. (IRPS, 2024)

Replacement Metal Gate Process Extendible Beyond 2-nm Node with Superior Gate Conductivity. - Naomi Yoshida; Ilanit Fisher; He Ren; Chi-Chou Lin; Chenfei Shen; Yongjing Lin; Yi Xu; Michael S.-. C. Chen; Mehul Naik (VLSI Technology and Circuits, 2024)