Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue. - Mei-Ling Wu (Microelectron. Reliab., 2010)

Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties. - Mei-Ling Wu; Donald Barker (Microelectron. Reliab., 2010)

Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events. - Mei-Ling Wu; Jia-Shen Lan (Microelectron. Reliab., 2018)

Advanced FOPoP technology in heterogeneous integration: Finite element analysis with element birth and death technique. - Mei-Ling Wu; Jin-Yu Wu (Simul. Model. Pract. Theory, 2025)