Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling. - Matthias Kraatz; Christoph Sander; André Clausner; Meike Hauschildt; Yvonne Standke; Martin Gall; Ehrenfried Zschech (IRPS, 2018)

Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. - Zhenjun Zhang; Matthias Kraatz; Meike Hauschildt; Seungman Choi; André Clausner; Ehrenfried Zschech; Martin Gall (IRPS, 2021)

A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. - J. Shuster-Passage; S. Abdel Razek; M. Mattoo; Meike Hauschildt; Seungman Choi; Martin Gall; Armen Kteyan; Jun-Ho Choy; Valeriy Sukharev; Matthias Kraatz; J. R. Lloyd (IRPS, 2024)