Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process. - Meiying Su; Liqiang Cao; Tingyu Lin 004; Feng Chen; Jun Li 104; Cheng Chen; Gengxin Tian (Microelectron. Reliab., 2018)

Design and Implementation of Financial Management Analysis Based on Big Data Platform of Psychiatric Hospital. - Meiying Su; Xinlei Chen (ICMTEL (1), 2021)

AI-Based Prediction of Warpage in Organic Substrates. - Jingyi Zhao; Meiying Su; Rui Ma (IEEE Access, 2025)

Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures. - Yunting Liu; Rong Fu; Meiying Su; Jun Li; Chuan Chen; Fengman Liu (Microelectron. J., 2025)