Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach. - Melina Lofrano; Kris Croes; Ingrid De Wolf; Christopher J. Wilson (Microelectron. Reliab., 2011)

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. - Bart Vandevelde; Andrej Ivankovic; B. Debecker; Melina Lofrano; Kris Vanstreels; Wei Guo; Vladimir Cherman; Marcel Gonzalez; Geert Van der Plas; Ingrid De Wolf; Eric Beyne; Zsolt Tokei (Microelectron. Reliab., 2014)

Stress mitigation of 3D-stacking/packaging induced stresses. - Kristof Croes; Vladimir Cherman; Melina Lofrano; Houman Zahedmanesh; Luka Kljucar; Mario Gonzalez; Ingrid De Wolf; Zsolt Tökei; Eric Beyne (IRPS, 2018)

Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. - Melina Lofrano; Vladimir Cherman; Mario Gonzalez; Eric Beyne (Microelectron. Reliab., 2018)

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. - Alicja Lesniewska; Olalla Varela Pedreira; Melina Lofrano; Gayle Murdoch; Marleen H. van der Veen; Anish Dangol; Naoto Horiguchi; Zsolt Tökei; Kris Croes (IRPS, 2021)

Assessment of critical Co electromigration parameters. - O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; Philippe J. Roussel; Marleen H. van der Veen; Veerle Simons; Emmanuel Chery; Ivan Ciofi; Kris Croes (IRPS, 2022)

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. - Youqi Ding; O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; T. Chavez; Hosain Farr; Ingrid De Wolf; Kris Croes (IRPS, 2023)

Towards accurate temperature prediction in BEOL for reliability assessment (Invited). - Melina Lofrano; Herman Oprins; Xinyue Chang; Bjorn Vermeersch; Olalla Varela Pedreira; Alicja Lesniewska; Vladimir Cherman; Ivan Ciofi; Kristof Croes; Seongho Park; Zsolt Tokei (IRPS, 2023)

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). - Subrat Mishra; Sankatali Venkateswarlu; Bjorn Vermeersch; Moritz Brunion; Melina Lofrano; Dawit Burusie Abdi; Herman Oprins; Dwaipayan Biswas; Odysseas Zografos; Gaspard Hiblot; Geert Van der Plas; Pieter Weckx; et al. (IRPS, 2023)