Residual compression in area array packages induced by underfill shrinkage. - Michael C. Larson; Melody A. Verges; Xia Liu (Microelectron. Reliab., 2006)

Experimental study and life prediction on high cycle vibration fatigue in BGA packages. - Xia Liu; Valmiki K. Sooklal; Melody A. Verges; Michael C. Larson (Microelectron. Reliab., 2006)