Geometric design for ultra-long needle probe card for digital light processing wafer testing. - Hao-Yuan Chang; Wen-Fung Pan; Meng-Kai Shih; Yi-Shao Lai (Microelectron. Reliab., 2010)

Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. - Yi-Shao Lai; Meng-Kai Shih; Chang-Chi Lee; Tong Hong Wang (Microelectron. Reliab., 2012)