Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model. - Meng-Kao Yeh; Chun-Lin Lu (Microelectron. Reliab., 2016)

Stress analysis of CMOS-MEMS microphone under shock loading by Taguchi method. - Chun-Lin Lu; Pei-Rong Ni; Meng-Kao Yeh (Microelectron. Reliab., 2018)