Developing 3D Heterogeneous Structures for Future Chips. - Cheng Li; Feilong Zhang 001; Mengfu Di; Zijin Pan; Albert Z. Wang (ICICDT, 2019)

Visible Light Communication Cyber-Physical Systems-on- Chip for Smart Cities. - Zijin Pan; Tian Lang; Cheng Li; Mengfu Di; Gang Chen 007; Yehuda E. Kalay; Ramdas Pai; Albert Z. Wang (J. Commun., 2019)

A 38GHz SPDT Traveling Wave Switch with 5A CDM ESD Protection in 45nm PDSOI for 5G System. - Mengfu Di; Weiquan Hao; Xunyu Li; Zijin Pan; Runyu Miao; Albert Z. Wang (RWS, 2023)