Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips. - Rui Hu; Mengru Huang; Linhong Lu; Fashun Yang; Jiexin Lin; Kui Ma; Zhao Ding (IEICE Electron. Express, 2024)

Fetal ultrasound four-chamber view editing synthesis via denoising diffusion model. - Sibo Qiao; Mengru Huang; Gang Luo; Wenjing Yin; Hengxiao Li; Min Wang 036; Zhihan Lyu (Expert Syst. Appl., 2026)