Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment. - Juha Karppinen; Jue Li; Toni T. Mattila; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2010)

FEM simulations for reliability assessment of component boards drop tested at various temperatures. - J. Li; Toni T. Mattila; H. Xu; Mervi Paulasto (Simul. Model. Pract. Theory, 2010)

Toward comprehensive reliability assessment of electronics by a combined loading approach. - Toni T. Mattila; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2011)

The reliability of component boards studied with different shock impact repetition frequencies. - Jussi Hokka; Jue Li; Toni T. Mattila; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2012)

Shock impact reliability characterization of a handheld product in accelerated tests and use environment. - Juha Karppinen; Jue Li; J. Pakarinen; Toni T. Mattila; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2012)

A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive. - Jue Li; Markus Turunen; Sini Niiranen; Hongtao Chen; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2012)

Improving the function of dopamine electrodes with novel carbon materials. - Emilia Kaivosoja; Emilia Berg; Antti Rautiainen; Tommi Palomäki; Jari Koskinen; Mervi Paulasto-Kröckel; Tomi Laurila (EMBC, 2013)

Mesh-based method for measuring intracranial volume in patients with craniosynostosis. - Antti G. Ritvanen; Marcelo Elias de Oliveira; Mika P. Koivikko; Harri O. Hallila; Juha K. Haaja; Virve S. Koljonen; Junnu P. Leikola; Jyri J. Hukki; Mervi Paulasto-Kröckel (Int. J. Comput. Assist. Radiol. Surg., 2013)

Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading. - Jue Li; Mikael Broas; Jani Raami; Toni T. Mattila; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2014)

Optimization of contact metallizations for reliable wafer level AuSn bonds. - Vesa Vuorinen; Antti Rautiainen; Hannele Heikkinen; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2016)

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects. - Glenn Ross; Vesa Vuorinen; Michael Krause 008; S. Reissaus; Matthias Petzold; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2017)