Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies. - Fen Chen; O. Bravo; Dave Harmon; Michael A. Shinosky; J. Aitken (Microelectron. Reliab., 2008)

Electron fluence driven, Cu catalyzed, interface breakdown mechanism for BEOL low-k time dependent dielectric breakdown. - Fen Chen; Michael A. Shinosky (Microelectron. Reliab., 2014)

A method for rapid screening of various low-k TDDB models. - Fen Chen; Carole Graas; Michael A. Shinosky; Chad Burke; Kai D. Feng; Craig Bocash; Ramachandran Muralidhar (IRPS, 2015)

Diagnostic electromigration reliability evaluation with a local sensing structure. - Fen Chen; Erik McCullen; Cathryn Christiansen; Michael A. Shinosky; Roger Dufresne; Prakash Periasamy; Rick Kontra; Carole Graas; Gary StOnge (IRPS, 2015)

Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges. - Fen Chen; Carole Graas; Michael A. Shinosky; Kai Zhao; Shreesh Narasimha; Xiao Hu Liu; Chunyan Tian (Microelectron. Reliab., 2015)