Placement for reliability and routability of convectively cooled PWBs. - Michael D. Osterman; Michael G. Pecht (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1990)

Weapon and communication systems: virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV). - Ricky Valentin; Jeremy Cunningham; Michael D. Osterman; Abhijit Dasgupta 002; Michael G. Pecht; Dinos Tsagos (WSC, 2002)

Statistical analysis of tin whisker growth. - Tong Fang; Michael D. Osterman; Michael G. Pecht (Microelectron. Reliab., 2006)

The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth. - Yuki Fukuda; Michael D. Osterman; Michael G. Pecht (Microelectron. Reliab., 2007)

Model for life prediction of fatigue-creep interaction. - Ricky Valentin; Donald Barker; Michael D. Osterman (Microelectron. Reliab., 2008)

Temperature and voltage aging effects on electrical conduction mechanism in epoxy-BaTiO3 composite dielectric used in embedded capacitors. - Mohammed A. Alam; Michael H. Azarian; Michael D. Osterman; Michael G. Pecht (Microelectron. Reliab., 2011)

Considerations in implementing canary based prognostics. - Sony Mathew; Michael D. Osterman; Michael G. Pecht (ICPHM, 2015)

An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model. - Elviz George; Michael D. Osterman; Michael G. Pecht (Microelectron. Reliab., 2015)

Assembly Options and Challenges for Electronic Products With Lead-Free Exemption. - Chien-Ming Huang 004; Anto Raj; Michael D. Osterman; Michael G. Pecht (IEEE Access, 2020)

How the Risk of Tin Whiskers Affects Design Decisions: Is the Aerospace and Defense Approach to Tin Whiskers the Right Approach. - Michael G. Pecht; Michael D. Osterman; Edwin C. Tinsley; Chang Lu (IEEE Access, 2025)