The effect of thermal constriction on heat management in a microelectronic application. - Mathias Ekpu; Raj S. Bhatti; Michael I. Okereke; Sabuj Mallik; Kenny C. Otiaba (Microelectron. J., 2014)

Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. - Mathias Ekpu; Raj S. Bhatti; Michael I. Okereke; Sabuj Mallik; Kenny C. Otiaba (Microelectron. Reliab., 2014)