Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications: dependence on advanced electronic packaging to achieve full performance. - Barry K. Gilbert; Michael J. Degerstrom; Patrick J. Zabinski; Thimothy M. Schafer; Gregg J. Fokken; Barbara A. Randall; Daniel J. Schwab; Erik S. Daniel; Scott C. Sommerfeldt (Proc. IEEE, 2001)

56 Gbps PCB Design Strategies for Clean, Low-Skew Channels. - Michael J. Degerstrom; Chad M. Smutzer; Barry K. Gilbert; Erik S. Daniel (CoRR, 2023)

Inverting the SerDes Link Design Flow Process. - Michael J. Degerstrom; Chad M. Smutzer; Patrick J. Zabinski; Barry K. Gilbert (CoRR, 2023)

Plated-Through-Hole Via Design Specifications for 112G Serial Links. - Michael J. Degerstrom; Chad M. Smutzer; Richard B. Ericson; Clifton R. Haider; Barry K. Gilbert (CoRR, 2023)