Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications. - Alvin J. Joseph; John D. Gillis; Mark Doherty; Peter J. Lindgren; Rosemary A. Previti-Kelly; Ramana M. Malladi; Ping-Chuan Wang; Mete Erturk; Hanyi Ding; Ephrem G. Gebreselasie; Michael J. McPartlin; James S. Dunn (IBM J. Res. Dev., 2008)

Fully Integrated Switch-LNA Front-End IC Design in CMOS: A Systematic Approach for WLAN. - Anuj Madan; Michael J. McPartlin; Zhan-Feng Zhou; Chun-Wen Paul Huang; Christophe Masse; John D. Cressler (IEEE J. Solid State Circuits, 2011)

A Highly Linear High-Power 802.11ac/ax WLAN SiGe HBT Power Amplifier Using a Compact 2nd-Harmonic-Shorting Four-Way Transformer and Integrated Thermal Sensors. - Inchan Ju; Michael J. McPartlin; Chun-Wen Paul Huang; Clifford D. Y. Cheon; Mark Doherty; John D. Cressler (ISSCC, 2019)