A 400 Gb/s WDM receiver using a low loss silicon nitride AWG integrated with hybrid silicon photodetectors. - Michael L. Davenport; Jared F. Bauters; Molly Piels; Martijn J. R. Heck; Arnold Chen; Alexander W. Fang; John E. Bowers 001 (OFC/NFOEC, 2013)

A hybrid silicon/InP integrated feedback stabilized mode-locked laser. - Michael L. Davenport; Sudharsanan Srinivasan; Martijn J. R. Heck; John E. Bowers 001 (OFC, 2014)

Narrow linewidth tunable laser using coupled resonator mirrors. - Tin Komljenovic; Michael L. Davenport; Sudharsanan Srinivasan; Jared Hulme; John E. Bowers 001 (OFC, 2015)

A Bandwidth-Dense, Low Power Electronic-Photonic Platform and Architecture for Multi-Tbps Optical I/O. - Mark T. Wade; Michael L. Davenport; Marc De Cea Falco; Pavan Bhargava; John Michael Fini; Derek Van Orden; Roy Meade; Evelina Yeung; Rajeev R. Ram; Milos A. Popovic; Vladimir Stojanovic; Chen Sun 003 (ECOC, 2018)

Degradation mechanisms of heterogeneous III-V/Silicon loop-mirror laser diodes for photonic integrated circuits. - Matteo Buffolo; M. Pietrobon; Carlo De Santi; F. Samparisi; Michael L. Davenport; John E. Bowers 001; Gaudenzio Meneghesso; Enrico Zanoni; Matteo Meneghini (Microelectron. Reliab., 2018)

Photonic Integrated Circuits Using Heterogeneous Integration on Silicon. - Tin Komljenovic; Duanni Huang; Paolo Pintus; Minh A. Tran; Michael L. Davenport; John E. Bowers 001 (Proc. IEEE, 2018)

TeraPHY: A High-Density Electronic-Photonic Chiplet for Optical I/O from a Multi-Chip Module. - Roy Meade; Shahab Ardalan; Michael L. Davenport; John Michael Fini; Chen Sun 003; Mark T. Wade; Alexandra Wright-Gladstein; Chong Zhang (OFC, 2019)

TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O. - Mark T. Wade; Roy Meade; Chandru Ramamurthy; Michael Rust; Forrest Sedgwick; Vladimir Stojanovic; Derek Van Orden; Chong Zhang; Chen Sun 003; Sergey Y. Shumarayev; Conor O'Keeffe; Erik Anderson; et al. (IEEE Micro, 2020)