Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. - Yeonsung Kim; Ah-Young Park; Chin-Li Kao; Michael Su; Bryan Black; Seungbae Park (Microelectron. Reliab., 2016)

Unleashing Fury: A New Paradigm for 3-D Design and Test. - Michael Alfano; Bryan Black; Jeff Rearick; Joseph Siegel; Michael Su; Julius Din (IEEE Des. Test, 2017)