Through Silicon Vias as Enablers for 3D Systems - E. Jung; Andreas Ostmann; Peter Ramm; Jürgen Wolf; Michael Toepper; Maik Wiemer (CoRR, 2008)

3-D thin chip integration technology - from technology development to application. - Thomas Fritzsch; Raul Mrossko; Tobias Baumgartner 003; Michael Toepper; Matthias Klein; Jürgen Wolf; Bernhard Wunderle; Herbert Reichl (3DIC, 2009)