New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions. - Davide Barlini; Mauro Ciappa; Alberto Castellazzi; Michel Mermet-Guyennet; Wolfgang Fichtner (Microelectron. Reliab., 2006)

Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications. - Alberto Castellazzi; Mauro Ciappa; Wolfgang Fichtner; G. Lourdel; Michel Mermet-Guyennet (Microelectron. Reliab., 2006)

Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current. - X. Perpiñà; Jean-François Serviere; J. Saiz; Davide Barlini; Michel Mermet-Guyennet; José Millán (Microelectron. Reliab., 2006)

Measurement of the transient junction temperature in MOSFET devices under operating conditions. - Davide Barlini; Mauro Ciappa; Michel Mermet-Guyennet; Wolfgang Fichtner (Microelectron. Reliab., 2007)

A study of the threshold-voltage suitability as an application-related reliability indicator for planar-gate non-punch-through IGBTs. - Alberto Castellazzi; Mauro Ciappa; Wolfgang Fichtner; M. Piton; Michel Mermet-Guyennet (Microelectron. Reliab., 2007)

Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications. - T. Lhommeau; Xavier Perpiñà; C. Martin; Régis Meuret; Michel Mermet-Guyennet; Moussa Karama (Microelectron. Reliab., 2007)

Revisiting power cycling test for better life-time prediction in traction. - Michel Mermet-Guyennet; X. Perpiñà; M. Piton (Microelectron. Reliab., 2007)

Failure-relevant abnormal events in power inverters considering measured IGBT module temperature inhomogeneities. - X. Perpiñà; Alberto Castellazzi; M. Piton; Michel Mermet-Guyennet; José Millán (Microelectron. Reliab., 2007)

Local thermal cycles determination in thermosyphon-cooled traction IGBT modules reproducing mission profiles. - X. Perpiñà; M. Piton; Michel Mermet-Guyennet; Xavier Jordà; José Millán (Microelectron. Reliab., 2007)

Virtual reliability assessment of integrated power switches based on multi-domain simulation approach. - Pierre Solomalala; J. Saiz; Michel Mermet-Guyennet; Alberto Castellazzi; Mauro Ciappa; X. Chauffleur; Jean-Pierre Fradin (Microelectron. Reliab., 2007)

Robustness test and failure analysis of IGBT modules during turn-off. - Jesús Urresti-Ibañez; Alberto Castellazzi; M. Piton; José Rebollo; Michel Mermet-Guyennet; Mauro Ciappa (Microelectron. Reliab., 2007)

Performance and reliability testing of modern IGBT devices under typical operating conditions of aeronautic applications. - Jean-Luc Fock Sui Too; B. Chauchat; Patrick Austin; Patrick Tounsi; Michel Mermet-Guyennet; Régis Meuret (Microelectron. Reliab., 2008)

IGBT module failure analysis in railway applications. - X. Perpiñà; Jean-François Serviere; Xavier Jordà; A. Fauquet; Salvador Hidalgo; Jesús Urresti-Ibañez; José Rebollo; Michel Mermet-Guyennet (Microelectron. Reliab., 2008)

Reliability of lead-free solder in power module with stochastic uncertainty. - Alexandre Micol; Carmen Martin; Olivier Dalverny; Michel Mermet-Guyennet; Moussa Karama (Microelectron. Reliab., 2009)

Long-Term Reliability of Railway Power Inverters Cooled by Heat-Pipe-Based Systems. - Xavier Perpiñà; Xavier Jordà; Miquel Vellvehí; José Rebollo; Michel Mermet-Guyennet (IEEE Trans. Ind. Electron., 2011)

Analysis of Clamped Inductive Turnoff Failure in Railway Traction IGBT Power Modules Under Overload Conditions. - Xavier Perpiñà; Jean-François Serviere; Jesús Urresti-Ibañez; Ignasi Cortés; Xavier Jordà; Salvador Hidalgo; José Rebollo; Michel Mermet-Guyennet (IEEE Trans. Ind. Electron., 2011)

A 100 kW 1.2 kV 20 kHz DC-DC converter prototype based on the Dual Active Bridge topology. - Thomas Lagier; Laurent Chedot; François Wallart; Layal Ghossein; Bruno Lefebvre; Piotr Dworakowski; Michel Mermet-Guyennet; Cyril Buttay (ICIT, 2018)