Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV). - Hiroshi Yoshikawa; Atsuko Kawasaki; Tomoaki Iiduka; Yasushi Nishimura; Kazumasa Tanida; Kazutaka Akiyama; Masahiro Sekiguchi; Mie Matsuo; Satoru Fukuchi; Katsutomu Takahashi (ISSCC, 2009)

Bringing in Cryogenics to Storage: Characteristics and Performance Improvement of 3D Flash Memory. - Yuta Aiba; Hitomi Tanaka; Takashi Maeda; Keiichi Sawa; Fumie Kikushima; Masayuki Miura; Toshio Fujisawa; Mie Matsuo; Hideto Horii; Hideko Mukaida; Tomoya Sanuki (IMW, 2021)