Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC. - Jongwoo Park 001; Jungpyo Hong; Miji Lee; Dongyoon Sun; Kyung Kang; Taesung Kim; Seungwon Kim; Sujin Kwon; Changkyu Joo; Sangsu Ha; Wooyeon Kim; Jongsu Ryu; et al. (IRPS, 2015)

Effects of front-end-of line process variations and defects on retention failure of flash memory: Charge loss/gain mechanism. - Jongwoo Park 001; Miji Lee; Hanbyul Kang; Wooram Ko; Eunkyeong Choi; Junsik Im; Minwoo Lee; Dohwan Chung; Jinchul Park; Sangchul Shin; Sangwoo Pae (IRPS, 2015)

Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation. - Jongwoo Park 001; Miji Lee; Kyunghwan Min; J.-K. Choi; Changkyu Joo; S.-C. Park; Hanbyul Kang; Sangwoo Pae (IRPS, 2015)

Machine learning-based anomaly detection via integration of manufacturing, inspection and after-sales service data. - Taehoon Ko; Je Hyuk Lee; Hyunchang Cho; Sungzoon Cho; Wounjoo Lee; Miji Lee (Ind. Manag. Data Syst., 2017)

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. - Younggeun Ji; Jeonghoon Kim; Jungin Kim; Miji Lee; Jaeheon Noh; Taeyoung Jeong; Juhyeon Shin; Junho Kim; Young Heo; Ung Cho; Hyun-Chul Sagong; Junekyun Park; et al. (IRPS, 2018)

A Study on Linguistic Management in Online and Offline Communities: Focusing on the Effect of Jargons on the Conflict. - U. Jin Baek; Miji Lee; Jongtae Lee (Int. J. Asian Bus. Inf. Manag., 2019)

Reliability on EUV Interconnect Technology for 7nm and beyond. - Tae-Young Jeong; Miji Lee; Yunkyung Jo; Jinwoo Kim; Min Kim; Myungsoo Yeo; Jinseok Kim 005; Hyunjun Choi; Joosung Kim; Yoojin Jo; Yongsung Ji; Taiki Uemura; et al. (IRPS, 2020)

Introduction to Voltage-Ramping Wafer Level Electromigration Method and Current Exponent Correction Factor for Co-Capping Metal Lines. - Da Yong Shin; Hyunjun Choi; Joosung Kim; Myungsoo Yeo; Miji Lee; Taiki Uemura; Shin-Young Chung; Jong-Ho Lee (IRPS, 2025)