Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. - Tomi Laurila; Toni T. Mattila; Vesa Vuorinen; Juha Karppinen; Jue Li; Mika Sippola; Jorma K. Kivilahti (Microelectron. Reliab., 2007)

Dynamical Characterization of Input-Voltage-Feedforward-Controlled Buck Converter. - Matti Karppanen; Teuvo Suntio; Mika Sippola (IEEE Trans. Ind. Electron., 2007)