Transient Simulations of Three-Dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume Approach. - Mike Chou; Tom Korsmeyer; Jacob White 001 (DAC, 1995)

Efficient reduced-order modeling for the transient simulation of three-dimensional interconnect. - Mike Chou; Jacob K. White 001 (ICCAD, 1995)

Efficient formulation and model-order reduction for the transient simulation of three-dimensional VLSI interconnect. - Mike Chou; Jacob K. White 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1997)

Multilevel Integral Equation Methods for the Extraction of Substrate Coupling Parameters in Mixed-Signal IC's. - Mike Chou; Jacob White 001 (DAC, 1998)

Efficient Techniques for Accurate Modeling and Simulation of Substrate Coupling in Mixed-Signal IC's. - João Paulo Costa; Mike Chou; L. Miguel Silveira (DATE, 1998)

Fast algorithms for ill-conditioned dense matrix problems in VLSI interconnect and substrate modeling. - Mike Chou (1998)

Efficient Techniques for Accurate Extraction and Modeling of Substrate Coupling in Mixed-Signal IC's. - João Paulo Costa; L. Miguel Silveira; Mike Chou (DATE, 1999)

Efficient techniques for accurate modeling and simulation ofsubstrate coupling in mixed-signal IC's. - João Paulo Costa; Mike Chou; Luís Miguel Silveira (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1999)