Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. - Mike Roellig; Rainer Dudek; Steffen Wiese; Bjoern Boehme; Bernhard Wunderle; Klaus-Jürgen Wolter; Bernd Michel (Microelectron. Reliab., 2007)

The effect of downscaling the dimensions of solder interconnects on their creep properties. - Steffen Wiese; Mike Roellig; Maik Mueller; Klaus-Jürgen Wolter (Microelectron. Reliab., 2008)

Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly. - Karsten M. Decker; René M. Rehmann; Mike Roellig; Karlheinz Bock (Microelectron. Reliab., 2018)

Experimental determination of the Young's modulus of copper and solder materials for electronic packaging. - Frank Kraemer; Mike Roellig; René Metasch; Joseph Al Ahmar; Karsten Meier; Steffen Wiese (Microelectron. Reliab., 2018)

Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load. - Marta Kuczynska; Natalja Schafet; Ulrich Becker; René Metasch; Mike Roellig; Alexander Kabakchiev; Stefan Weihe (Microelectron. Reliab., 2018)

A new Method for the in vivo identification of material properties of the human eye. Feasibility analysis based on synthetic data. - Stefan Muench; Mike Roellig; Daniel Balzani (CoRR, 2021)

Performance Assessment of different Machine Learning Algorithm for Life-Time Prediction of Solder Joints based on Synthetic Data. - Stefan Muench; Darshankumar Bhat; Leonhard Heindel; Peter Hantschke; Mike Roellig; Markus Kästner (CoRR, 2022)