Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires. - Miku J. Laakso; Simon J. Bleiker; Jessica Liljeholm; Gustaf E. Martensson; Mikhail Asiatici; Andreas C. Fischer; Göran Stemme; Thorbjorn Ebefors; Frank Niklaus (IEEE Access, 2018)