Transitive Closure Graph-Based Warpage-Aware Floorplanning for Package Designs. - Yang Hsu; Min-Hsuan Chung; Yao-Wen Chang; Ci-Hong Lin (ICCAD, 2022)

Any-Angle Routing for Redistribution Layers in 2.5D IC Packages. - Min-Hsuan Chung; Je-Wei Chuang; Yao-Wen Chang (DAC, 2023)