Automatic 2 1/2 D shape inspection system for via-hole fillings of green sheets by shadow image analysis. - Takanori Ninomiya; Mineo Nomoto; Yasuo Nakagawa (ICRA, 1989)

Automatic screen-printed circuit pattern inspection using connectivity preserving image reduction and connectivity comparison. - Takanori Ninomiya; Kazushi Yoshimura; Mineo Nomoto; Yasuo Nakagawa (ICPR (1), 1992)

Automated solder joint inspection system using optical 3-D image detection. - Yukio Matsuyama; Toshifumi Honda; Hisae Yamamura; Hideaki Sasazawa; Mineo Nomoto; Takanori Ninomiya; Anton Schick; Ludwig Listl; Paul Köllensperger; Dieter Spriegel; Peter Mengel; Richard Schneider (WACV, 1996)

Automated Visual Inspection for Solder Joints of PCB Based on 3-D Image Analysis. - Toshifumi Honda; Hisae Yamamura; Mineo Nomoto; Takanori Ninomiya; Tomoharu Horii; Yoshio Miyawaki (J. Robotics Mechatronics, 1999)