Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. - Yue Ying Ong; Soon Wee Ho; Kripesh Vaidyanathan; Vasarla Nagendra Sekhar; Ming Chinq Jong; Samuel Lim Yak Long; Vincent Lee Wen Sheng; Leong Ching Wai; Vempati Srinivasa Rao; Jimmy Ong; Xuefen Ong; Xiaowu Zhang; et al. (Microelectron. Reliab., 2010)

1.6 Tbps (224 Gbps/λ) Silicon Photonic Engine Fabricated with Advanced Electronic-Photonic FOWLP for Co-Packaged Optics and Linear Drive Applications. - Xin Li; Sajay B. N. Gourikutty; Jiaqi Wu; Teck Guan Lim; Pengfei Guo; Jaye C. Davies; Sing-Chee Koh; Lau Boon Long; Ming Chinq Jong; Chao Li; Guo-Qiang Lo; Surya Bhattacharya; et al. (OFC, 2024)