Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. - Chia-Tai Kuo; Ming-Chuen Yip; Kuo-Ning Chiang (Microelectron. Reliab., 2004)

Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate. - Chien-Hsin Huang; Chien-Hsing Lee; Tsung-Min Hsieh; Li-Chi Tsao; Shaoyi Wu; Jhyy-Cheng Liou; Mingyi Wang; Li-Che Chen; Ming-Chuen Yip; Weileun Fang (Sensors, 2011)