Cyclic bending reliability of wafer-level chip-scale packages. - Yi-Shao Lai; Tong Hong Wang; Han-Hui Tsai; Ming-Hwa R. Jen (Microelectron. Reliab., 2007)

Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. - Ming-Hwa R. Jen; Lee-Cheng Liu; Yi-Shao Lai (Microelectron. Reliab., 2009)