Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method. - Miao Cai; Zhi Liang; Kunmiao Tian; Minghui Yun; Ping Zhang; Dao-Guo Yang; Guoqi Zhang (IEEE Access, 2019)

Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs. - Miao Cai; Yonghu Liang; Minghui Yun; Xuan-You Chen; Haidong Yan; Zhaozhe Yu; Dao-Guo Yang; Guoqi Zhang (IEEE Access, 2019)

Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization. - Hengjian He; Miao Cai; Minghui Yun; Hao Chen; Huanhuan Wang; Dao-Guo Yang (IEEE Trans. Instrum. Meas., 2024)