The Research of Adaptive Fuzzy PID Control Algorithm Based on LQR Approach in DC-DC Converter. - Kexin Wei; Qiang Sun; Bin Liang; Mingxing Du (PACIIA (1), 2008)

Linguistic Unit Discovery from Multi-Modal Inputs in Unwritten Languages: Summary of the "Speaking Rosetta" JSALT 2017 Workshop. - Odette Scharenborg; Laurent Besacier; Alan W. Black; Mark Hasegawa-Johnson; Florian Metze; Graham Neubig; Sebastian Stüker; Pierre Godard; Markus Müller 001; Lucas Ondel; Shruti Palaskar; Philip Arthur; et al. (ICASSP, 2018)

Learning Word Embeddings: Unsupervised Methods for Fixed-size Representations of Variable-length Speech Segments. - Nils Holzenberger; Mingxing Du; Julien Karadayi; Rachid Riad; Emmanuel Dupoux (INTERSPEECH, 2018)

Condition Monitoring of IGBT Modules Based on Changes of Thermal Characteristics. - Kexin Wei; Wenbai Wang; Zhen Hu; Mingxing Du (IEEE Access, 2019)

Speech Technology for Unwritten Languages. - Odette Scharenborg; Lucas Ondel; Shruti Palaskar; Philip Arthur; Francesco Ciannella; Mingxing Du; Elin Larsen; Danny Merkx; Rachid Riad; Liming Wang 003; Emmanuel Dupoux; Laurent Besacier; et al. (IEEE ACM Trans. Audio Speech Lang. Process., 2020)

Bond wire lift-off monitoring based on intersection point movement characteristic in IGBT module. - Mingxing Du; Jinlei Xin; Hongbin Wang; Ziwei Ouyang; Kexin Wei (Microelectron. J., 2021)

Project Driven Practical Teaching Reform Based on U+ EEC - Taking the Course "Engineering Training II" as an Example. - Xin Wang 150; Mingxing Du; Jinglei Zhang; Xiaoping He (ICETC, 2023)

Bond wires aging monitoring for IGBT module based on junction temperature difference of TSEPs. - Yulin Liu; Mingxing Du; Jinliang Yin; Chao Dong (IEICE Electron. Express, 2023)

Parameter extraction method for Cauer model considering dynamic thermal diffusion boundaries in IGBT module. - Chao Dong; Jingwei Hu; Mingxing Du (Microelectron. J., 2023)

A parameter self-correcting thermal network model considering IGBT module solder layer aging. - Yulin Liu; Mingxing Du; Jinliang Yin; Chao Dong (Microelectron. J., 2023)

Monitoring method of solder layer void damage of IGBT module based on transfer function. - Xiyuan Huang; Xiepeng Sun; Gengji Wang; Jinliang Yin; Mingxing Du (IEICE Electron. Express, 2024)

Study on the influence mechanism of gate oxide degradation on DM EMI signals in SiC MOSFET. - Chao Dong; Sai Gao; Yulin Liu; Gengji Wang; Jinliang Yin; Mingxing Du (Microelectron. J., 2024)

Digital twin of intermediate layer temperatures observation of IGBT modules. - Mingxing Du; Xinyu Cai; Cong Zhang (IEICE Electron. Express, 2025)

In Situ Monitoring Bonding Wires Fatigue in IGBT Power Modules Using Differential Mode Impedance Extracted From Dual Current Probe Technology. - Mingxing Du; Shaoxiang Wang; Jianxiong Yang; Jinliang Yin (IEEE Trans. Instrum. Meas., 2025)