A 40 Gs/s Time Interleaved ADC Using SiGe BiCMOS Technology. - Michael Chu; Philip Jacob 001; Jin Woo Kim; Mitchell R. LeRoy; Russell P. Kraft; John F. McDonald 001 (IEEE J. Solid State Circuits, 2010)

Correction to "A 40 GS/s Time Interleaved ADC Using SiGe BiCMOS Technology". - Michael Chu; Philip Jacob 001; Jin Woo Kim; Mitchell R. LeRoy; Russell P. Kraft; John F. McDonald 001 (IEEE J. Solid State Circuits, 2010)

Carry Chains for Ultra High-Speed SiGe HBT Adders. - Alexey Gutin; Philip Jacob 001; Michael Chu; Paul M. Belemjian; Mitchell R. LeRoy; Russell P. Kraft; John F. McDonald 001 (IEEE Trans. Circuits Syst. I Regul. Pap., 2011)

A three-dimensional DRAM using floating body cell in FDSOI devices. - Xuelian Liu; Aamir Zia; Mitchell R. LeRoy; Srikumar Raman; Ryan Clarke; Russell P. Kraft; John F. McDonald 001 (DDECS, 2012)

Design of BiCMOS SRAMs for high-speed SiGe applications. - Xuelian Liu; Mitchell R. LeRoy; Ryan Clarke; Michael Chu; H. O. Aquino; Srikumar Raman; Aamir Zia; Russell P. Kraft; John F. McDonald 001 (IET Circuits Devices Syst., 2014)

Design of High-Speed Register Files Using SiGe HBT BiCMOS Technology. - Xuelian Liu; Srikumar Raman; Ryan Clarke; Mitchell R. LeRoy; Okan Erdogan; Michael Chu; Alexey Gutin; Russell P. Kraft; John F. McDonald 001 (IEEE Trans. Circuits Syst. II Express Briefs, 2014)

Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU. - Ryan Clarke; Philip Jacob 001; Okan Erdogan; Paul Belemijian; Srikumar Raman; Mitchell R. LeRoy; Tuhin Guha Neogi; Russell P. Kraft; Diana-Andra Borca-Tasciuc; John F. McDonald 001 (IEEE Access, 2015)

140 Gb/s Serializer Using Clock Doublers in 90 nm SiGe Technology. - Ryan Clarke; Mitchell R. LeRoy; Srikumar Raman; Tuhin Guha Neogi; Russell P. Kraft; John F. McDonald 001 (IEEE J. Solid State Circuits, 2015)

High-Speed Reconfigurable Circuits for Multirate Systems in SiGe HBT Technology. - Mitchell R. LeRoy; Srikumar Raman; Michael Chu; Jin Woo Kim; Jong-Ru Guo; Kuan Zhou; Chao You; Ryan Clarke; Bryan S. Goda; John F. McDonald 001 (Proc. IEEE, 2015)