Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. - Mariappan Murugesan; Takafumi Fukushima; Ji Chel Bea; K. W. Lee; Mitsu Koyanagi; Y. Imai; S. Kimura; Tetsu Tanaka (3DIC, 2014)

Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. - K. W. Lee; Ji Chel Bea; Mitsu Koyanagi; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2015)

Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. - Mariappan Murugesan; Jichoel Bea; Hiroyuki Hashimoto; K. W. Lee; Mitsu Koyanagi; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2015)

Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal. - Mariappan Murugesan; Takafumi Fukushima; Ji Chel Bea; Hiroyuki Hashimoto; Mitsu Koyanagi (IRPS, 2018)