Effect of the drop impact on BGA/CSP package reliability. - Kinuko Mishiro; Shigeo Ishikawa; Mitsunori Abe; Toshio Kumai; Yutaka Higashiguchi; Ken-ichiro Tsubone (Microelectron. Reliab., 2002)

Evaluation of the High-Frequency Transmission Characteristics of Coplanar Transmission Lines Fabricated on a Copper-Plated Cycloolefin Polymer Using a Direct Sputtering Copper Seed Layer. - Akihiro Shimizu; Kazuhiro Fukada; Mitsunori Abe; Akiko Matsui; Shinichi Endo (IEEE Access, 2025)