Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias. - Mostafa Said; Farhad Mehdipour; Mohamed El-Sayed 011 (DSD, 2013)

A Design Methodology for Performance Maintenance of 3D Network-on-Chip with Multiplexed Through-Silicon Vias. - Mostafa Said; Farhad Mehdipour; Kazuaki J. Murakami; Mohamed El-Sayed 011 (MES@ISCA, 2014)

Keep-Out-Zone analysis for three-dimensional ICs. - Mostafa Said; Mohamed El-Sayed 011; Farhad Mehdipour; Nobuaki Miyakawa (VLSI-DAT, 2014)

A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias. - Mostafa Said; Ahmed Shalaby 001; Farhad Mehdipour; Morteza Biglari-Abhari; Mohamed El-Sayed 011 (Microprocess. Microsystems, 2016)

Non-Parallel Training Approach for Emotional Voice Conversion Using CycleGAN. - Mohamed Elsayed 011; Sama Hadhoud; Alaa Elsetohy; Menna Osman; Walid Gomaa 001 (ICINCO (2), 2023)