Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. - Mohamed Naeim; Hanqi Yang; Pinhong Chen; Rong Bao; Antoine Dekeyser; Giuliano Sisto; Moritz Brunion; Rongmei Chen; Geert Van der Plas; Eric Beyne; Dragomir Milojevic (3DIC, 2023)

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC. - Mohamed Naeim; Herman Oprins; Sudipta Das; Geert Van der Plas; Yun Dai; Pinhong Chen; CT Kao; Dwaipayan Biswas; Dragomir Milojevic (ISVLSI, 2024)

Backside Power Delivery in High Density and High Performance Context: IR-Drop and Block-Level Power-Performance-Area Benefits. - Yun Zhou; S. C. Song; Halil Kükner; Giuliano Sisto; Sheng Yang; Anita Farokhnejad; Mohamed Naeim; Moritz Brunion; Ji-Yung Lin; Odysseas Zografos; Pieter Weckx; Shashank Ekbote; et al. (VLSI Technology and Circuits, 2024)

Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures. - Leandro Mateus Giacomini Rocha; Refik Bilgic; Mohamed Naeim; Sudipta Das; Herman Oprins; Amirreza Yousefzadeh; Mario Konijnenburg; Dragomir Milojevic; James Myers; Julien Ryckaert; Dwaipayan Biswas (IEEE Trans. Very Large Scale Integr. Syst., 2024)

Bandwidth-Latency-Thermal Co-Optimization of Interconnect-Dominated Many-Core 3D-IC. - Sudipta Das; Samuel Riedel; Mohamed Naeim; Moritz Brunion; Marco Bertuletti; Luca Benini; Julien Ryckaert; James Myers; Dwaipayan Biswas; Dragomir Milojevic (IEEE Trans. Very Large Scale Integr. Syst., 2025)