A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. - Dhafer Abdulameer Shnawah; Mohd Faizul Mohd Sabri; Irfan Anjum Badruddin (Microelectron. Reliab., 2012)

Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products. - Dhafer Abdulameer Shnawah; Suhana Binti Mohd Said; Mohd Faizul Mohd Sabri; Irfan Anjum Badruddin; Fa Xing Che (Microelectron. Reliab., 2012)

Microstructure of Sn-1Ag-0.5Cu solder alloy bearing Fe under salt spray test. - Nor Ilyana Muhd Nordin; Suhana Mohd Said; Roziana Ramli; Mohd Faizul Mohd Sabri; N. M. Sharif; N. A. F. N. M. Arifin; N. N. S. Ibrahim (Microelectron. Reliab., 2014)

Enhanced Ethanol Gas Sensing Properties of SnO2-Core/ZnO-Shell Nanostructures. - T. Tharsika; A. S. M. A. Haseeb; Sheikh A. Akbar; Mohd Faizul Mohd Sabri; Wong Yew Hoong (Sensors, 2014)

The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy. - Mohammad Hossein Mahdavifard; Mohd Faizul Mohd Sabri; Dhafer Abdulameer Shnawah; Suhana Mohd Said; Irfan Anjum Badruddin; S. Rozali (Microelectron. Reliab., 2015)

Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys. - Mohd Faizul Mohd Sabri; Nor Ilyana Muhd Nordin; Suhana Mohd Said; Nur Aishah Aminah Mohd Amin; Hamzah Arof; Iswadi Jauhari; Roziana Ramli; Kirsten Weide-Zaage (Microelectron. Reliab., 2015)

Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders. - Bakhtiar Ali; Mohd Faizul Mohd Sabri; Iswadi Jauhari; Nazatul Liana Sukiman (Microelectron. Reliab., 2016)

Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. - Bakhtiar Ali; Mohd Faizul Mohd Sabri; Suhana Binti Mohd Said; Nazatul Liana Sukiman; Iswadi Jauhari; Mohammad Hossein Mahdavifard (Microelectron. Reliab., 2018)