Design of an underwater glider platform for shallow-water applications. - Nur Afande Ali Hussain; Ting Ming Chung; Mohd Rizal Arshad; Rosmiwati Mohd-Mokhtar; Mohd Zulkifly Abdullah (Int. J. Intell. Def. Support Syst., 2010)

Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process. - C. Y. Khor; M. Abdul Mujeebu; Mohd Zulkifly Abdullah; F. Che Ani (Microelectron. Reliab., 2010)

Design of DNA biosensors and amperometric microchips featuring copper electrodes. - Motasem H. Ghanim; Kamariah Hasan; Nazalan Najimudin; Mohd Zulkifly Abdullah (BHI, 2012)

Investigation of the fluid/structure interaction phenomenon in IC packaging. - C. Y. Khor; Mohd Zulkifly Abdullah; H. J. Tony Tan; W. C. Leong; D. Ramdan (Microelectron. Reliab., 2012)

Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. - Chun-Sean Lau; Mohd Zulkifly Abdullah; F. Che Ani (Microelectron. Reliab., 2012)

Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance. - W. C. Leong; Mohd Zulkifly Abdullah; C. Y. Khor (Microelectron. Reliab., 2012)

Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology. - C. Y. Khor; Mohd Zulkifly Abdullah (Simul. Model. Pract. Theory, 2012)

Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging. - C. Y. Khor; Mohd Zulkifly Abdullah (Microelectron. Reliab., 2013)

Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology. - W. C. Leong; Mohd Zulkifly Abdullah; C. Y. Khor (Microelectron. Reliab., 2013)

FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process. - Ernest E. S. Ong; Mohd Zulkifly Abdullah; W. K. Loh; C. K. Ooi; R. Chan (Microelectron. Reliab., 2013)

Recent fluid-structure interaction modeling challenges in IC encapsulation - A review. - C. Y. Khor; Mohd Zulkifly Abdullah; Chun-Sean Lau; I. A. Azid (Microelectron. Reliab., 2014)

Influence of solder bump arrangements on molded IC encapsulation. - C. Y. Khor; Mohd Zulkifly Abdullah; Chun-Sean Lau; W. C. Leong; M. S. Abdul Aziz (Microelectron. Reliab., 2014)

Thermal analysis of dual piezoelectric fans for cooling multi-LED packages. - Shaker Farid Sufian; Z. M. Fairuz; Mohammed Zubair; Mohd Zulkifly Abdullah; Julie Juliewatty Mohamed (Microelectron. Reliab., 2014)

Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology. - M. S. Abdul Aziz; Mohd Zulkifly Abdullah; C. Y. Khor; I. A. Azid (Simul. Model. Pract. Theory, 2015)

Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem. - Aizat Abas; Noorhafizah Hafizah Mokhtar; Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; Ang H. O. Tian (Comput. Math. Methods Medicine, 2016)

Lattice Boltzmann method study of bga bump arrangements on void formation. - Aizat Abas; Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; F. Che Ani; Soon Fuat Khor (Microelectron. Reliab., 2016)

Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process. - Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; Aizat Abas (Microelectron. Reliab., 2016)

Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. - Fei Chong Ng; Aizat Abas; Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; M. S. Abdul Aziz (Microelectron. Reliab., 2016)

Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages. - M. S. Haslinda; Aizat Abas; F. Che Ani; A. Jalar; Abdullah Aziz Saad; Mohd Zulkifly Abdullah (Microelectron. Reliab., 2017)

Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board. - Chong Hooi Lim; Mohd Zulkifly Abdullah; Ishak Abdul Azid; M. S. Abdul Aziz (Microelectron. Reliab., 2017)

Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering. - A. M. Najib; Mohd Zulkifly Abdullah; Abdullah Aziz Saad; Z. Samsudin; F. Che Ani (Microelectron. Reliab., 2017)

Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. - Fei Chong Ng; Aizat Abas; Z. L. Gan; Mohd Zulkifly Abdullah; F. Che Ani; M. Yusuf Tura Ali (Microelectron. Reliab., 2017)

Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink. - Shaker Farid Sufian; Mohd Zulkifly Abdullah (Microelectron. Reliab., 2017)

Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality. - Srivalli Chellvarajoo; Mohd Zulkifly Abdullah (Microelectron. Reliab., 2018)

Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. - Fei Chong Ng; Aizat Abas; Mohd Zulkifly Abdullah (Microelectron. Reliab., 2018)

Entropy Generation and Exergy Analysis of Premixed Fuel-Air Combustion in Micro Porous Media Burner. - Nazmi Che Ismail; Mohd Zulkifly Abdullah; Nurul Musfirah Mazlan; Khairil Faizi Mustafa (Entropy, 2020)

Double-Layer Micro Porous Media Burner from Lean to Rich Fuel Mixture: Analysis of Entropy Generation and Exergy Efficiency. - Nazmi Che Ismail; Mohd Zulkifly Abdullah; Khairil Faizi Mustafa; Nurul Musfirah Mazlan; Prem Gunnasegaran; Agustinus Purna Irawan (Entropy, 2021)

Design and Fabrication of a Dual Rotor-Embedded Wing Vertical Take-Off and Landing Unmanned Aerial Vehicle. - Seng Man Wong; Hann Woei Ho; Mohd Zulkifly Abdullah (Unmanned Syst., 2021)